Nanoscale MOSFETs

 Summary

            We are exploring more and more refined models of nanoscale field-effect transistors, with the general goal to determine the ultimate scaling limits for this workhorse components of silicon integrated circuits. While our first models have ignored the major parasitic effect of source-to-drain tunneling altogether [1] or used the simple WKB approximation for the description of this effect [2, 3], more recent versions of the theory [4-6] are based on the joint solution of the 1D Schrödinger equation with 2D Poisson equation. The results show that while advanced Si MOSFETs may provide voltage gain even at channel length as small as 2 nm (~8 silicon atoms long), below ~10 nm virtually all their characteristics (notably the threshold value of the gate voltage) become increasingly sensitive to random variation of device parameters including all geometrical dimensions.

 Publications

 

                   1. F. Pikus and K. Likharev, "Nanoscale field-effect transistors: An ultimate size analysis", Appl. Phys. Lett., vol. 71, pp. 3661-3663, Dec. 1997.
                   2. Y. Naveh, A. Korotkov, and K. Likharev, "Shot-noise suppression in multimode ballistic Fermi conductors", Phys. Rev. B, vol. 60, pp. R2169-2172, July 1999.
                   3. Y. Naveh and K. Likharev, "Modeling of 10-nm-scale ballistic MOSFET's", IEEE Electron. Device Lett., vol. 21, pp. 242-244, May 2000.
                   4. V. A. Sverdlov, T. J. Walls, and K. K. Likharev, Nanoscale Silicon MOSFETs: A theoretical study”, IEEE Trans. on Electron Devices, vol. 50, pp. 1926-1933, Sept. 2003.
                   5. T. J. Walls, V. A. Sverdlov,  and K. K. Likharev, “Nanoscale SOI MOSFETs: A comparison of two options”, Solid State Electronics, vol. 48, pp. 857-865, 2004.
                   6. J. B. Li, T. J. Walls, and K. K. Likharev, "Nanoscale SOI MOSFETs: In search for the best geometry", in: SOI Technology and Devices XII, ed. by G. K. Celler, ECS, Pennington, NJ, 2005, pp. 11-20.

 

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